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SiC Automotive
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Automotive Rectifier
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Protection Diode

Transient Voltage Suppressor
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Thyristor
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Automotive Protection Diode
Transient Voltage Suppressor ESD Protection Diode Power Zener Diode

Small Signal

Small Signal Switching Diode
Small Signal Schottky Diode
Small Signal Zener Diode
Small Signal Transisitor
Small Signal Digital Transisitor
Power Transistor

Automotive Small Signal
Small Signal Switching Diode Small Signal Schottky Diode Small Signal Zener Diode Small Signal Transisitor Power Transistor Small Signal Digital Transisitor

MOSFET

ALL MOSFET
Automotive MOSFET

High-voltage MOSFET(500V-1000V)
SJ MOSFET SiC MOSFET Planner MOSFET

Low & Medium Voltage MOSFET(12V-400V)
N-Channel MOSFET P-Channel MOSFET

NP MOSFET(12V-300V)
Complementary MOSFET Dual N-Channel MOSFET Dual P-Channel MOSFET Half-bridge MOSFET

IGBT

IGBT Module
IGBT Discrete
IGBT Automotive

Module

Rectifier Diodes Module
Fast Recovery Module
Schottky Module
Thyristor Module
Thyristor / Rectifier Diode Module
Fast/Phase-controlled Thyristor

SiC

SiC Schottky Diode
SiC MOSFET
SiC Schottky Diode Modules
SiC MOSFET Modules
SiC Automotive Schottky Diode
SiC Automotive MOSFET

4/5″wafer

STD Chip
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EPI Chip
TVS Chip
HVB High Voltage Module Chip
Automotive Electronics Chip

6″wafer

TSBD Chip
PSBD Chip
FRED Chip
LBD Chip
PMBD Chip
ESD Chip

Integrated circuit

LOAD Switches
LDO
Shunt Regulator
DC-DC

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SOD-323HE SMD Type TVS Products

SOD-323HE SMD Type TVS Products Back

PDF

Introduction 1.Ultra-thin package, can be applied to miniaturized, thin circuit;
2.The underside of the package has a heat sink, heat dissipation performance is excellent;
3. It uses environmentally friendly materials, in line with RoHS standards;
4. Widely used in secondary rectifier circuit, converter, continuous current diode, AC/DC power supply protection;

Features 1.Excellent heat dissipation performance: the back Pad area is large, compared with the change of SOD-123FL heat dissipation path, the original pin heat dissipation is changed to the back metal plate Pad heat dissipation, the metal heat dissipation area is increased by 89%.
2. Small package shape: compared with SOD-123HE package length is reduced by 56%, the width is reduced by 56%, meeting the development trend of package miniaturization.

SPECIFICATION

SMHE SERIES

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